210mm wafer with SMBB cell technology

Up to 95% bifaciality

Competitive high-temperature performance  with ameliorated temperature coefficient (-0.24%/°C）

Better weak illumination response of HJT technology leads higher power generation

N-type with lower LID and LeTID

Industry-leading cell technology of TCO thin film contributes to excellent anti-PlD characteristic

Sealing with PlB based sealant to achieve stronger water resistance, greater air impermeability and longer module lifespan

Lower BoS cost ensure a better LCOE

Low temperature welding technology & shorter manufacturing process contributes to lower carbon emissions